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The EMI Shielding Film Market research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027. by Application segment also provides consumption during the forecast period of 2016 to 2027.
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EMI SHIELDING FILM Line-up Solution for Designing Noise …
TATSUTA EMI shielding films have been applying our multi thin layers technology using metallic thin layer, with using our technologies including such as …
Source: nmmjx-dc.com
Date Published: 9/24/2022
View: 444
Tatsuta EMI Shielding Solutions – PDF Free Download
TATSUTA ECTC Tatsuta EMI Shielding Solutions May 30, 2019 Mike Sakaguchi … 3 Company Profile #1 Market Share EMI Shielding Film OTHERS RA Cu Foil 6N Cu …
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Date Published: 2/5/2021
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Tatsuta EMI Shielding FilmApril_2016_Grab_new_product.pdf
Transfer film (White PET)Protection layer：5umAntistrophic conductive adhesive layer：Shielding layer：0.3um(New)SF-PC8000 seriesIsotropic conductive …
Source: www.coursehero.com
Date Published: 1/29/2021
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Tatsuta EMI Shielding Solutions – ECTC
EMI Shielding film. (Thermosetting, Thermoplastic, PSA type). ・ Free Grounding film. ・ Bonding film. (Conductive , Non-Conductive type).
Source: www.ectc.net
Date Published: 11/12/2021
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Competing with international EMI shielding film giants Tatsuta …
In 2000, Tatsuta, a Japanese company established in 1945, took the lead in launching metal alloy electromagnetic shielding films, which met the need for …
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Date Published: 1/10/2022
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주제와 관련된 더 많은 사진을 참조하십시오 EMI Shielding Film Market Research Report 2021. 댓글에서 더 많은 관련 이미지를 보거나 필요한 경우 더 많은 관련 기사를 볼 수 있습니다.
주제에 대한 기사 평가 tatsuta emi shielding film
- Author: mishiti roy
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- Date Published: 2021. 1. 7.
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EMI Shielding Film Lineup Solution for Designing Noise Countermeasures (TATSUTA Electric Wire and Cable Co., Ltd.)｜Special Online Exhibition Site of JX Nippon Mining & Metals
TATSUTA EMI shielding films have been applying our multi thin layers technology using metallic thin layer, with using our technologies including such as electric properties, layout of board, and process methods can contribute End customers’ challenges to suppress noise so that they can select some as possible solution. Also we have supplementary products to generate design freedom, one of them is Free Grounding Film that is enable a micro wiring board to strengthen GND connection on EMI shielding film +FPC.
・SF-PC series ・・・・・
Process it on FPC process line because its adhesion is thermal setting type.
Process it on FPC process line because its adhesion is thermal setting type. ・SF-CA series ・・・・・
Use it on many varieties electric devise due to pressure sensitive adhesion as its adhesion layer.
Use it on many varieties electric devise due to pressure sensitive adhesion as its adhesion layer. ・FGF series ・・・・・
Supplementary material for SF-PC series, enable to take GND connection on EMI shielding film, enhancing design freedom.
Tatsuta EMI Shielding Solutions
14 Roadmap Silver coated copper Via filling FMV High heat resistant for SIC,IGBT Copper Metallizing/TLPS Silver and Copper Hybrid Via filling AE series 2005 Via filling MP series 2010 Stress Relaxation for MLCC electrode SMT for active components SMT for passive components 2015 Solderable for pad & trace Copper inlay EMI Shielding Spray type Via filling LCP Bendable type 2020 EMI shielding Spray type 5G/6G EMI Shielding Spray type Low temp. cure Shielding NF2000EX TH connect TH9980 EMI shielding Spray type Low frequency
13 5G/6G EMI Shielding & Thermal Management Solutions Spray & Jetting Sputter/Spray IC PKG Small Size SiP & Entire Board Large Size Thermal Release + EMI Shielding Process Stress Free Spray Coating for Wide Area Paste Filling in Narrow Trench and Micro FMV Low Temperature Curing Material Thin & High SE Hybrid Metal Formulation High Peeling Strength Resin Formulation 13
8 Shielding effectiveness EMI Shielding Film Lineup for FPC EMI Shielding Film Road Map with Signal Environment Important Functional Property SF-PC Expand Needs to Intra EMC 2.Keeping Wave form Quality SF- PC5600 Standard SF- PC5900 Ultra Thin SF-PC6000-U1(N) High Step SF-PC8600 Standard More Shielding Frequency band SF-PC8900 Ultra Thin More Shielding SF-PC3300/3500-P2 High Frequency High Shielding FGF-series GND-Strength FPC Length = 100mm High Frequency Best Shielding FPC Roadmap for Mobile Smartphone 1. EMC / GND Strength 2. Total Thickness 3. Smaller 4. High Frequency etc.. We have solution line up above design Issue. 5G- 5G USB3.2 USB3.2 D-PHY v1.1 D-PHY v1.2 M-PHY(C-phy) 8
7 Paste Lineup for PCB/FPC and Semiconductor EMI Shielding (Compartment) SMT (Low Temp.) EMI Shielding (Conformal) Circuity, Antenna (Low Temp.) Gap Control SMT Via Filling (Thermal Conductive) Via Filling (TLPS) 7
6 Paste Lineup for PCB/FPC and Semiconductor Segment PCB FPC PCB FPC Multilayer Build up Multilayer LCP Application Automotive Mobile PKG HPC Semiconductor SMT Consumer/IOT Other 6
5 5 Products Lineup in System Electronic Division EMI Shielding (Conformal & Compartment Shielding) Via filling (Electric conductive & Thermal Conductive) Circuitry / Electrode (Solderable) SMT(Low Temp. Curing) EMI Shielding film (Thermosetting, Thermoplastic, PSA type) Free Grounding film Bonding film (Conductive, Non-Conductive type) Masking film for reflow process Gold bonding wire Copper bonding wire Silver bonding wire Water Leakage Sensor Medical Sensor
1 No. TATSUTA ECTC Tatsuta EMI Shielding Solutions May 30, 2019 Mike Sakaguchi TATSUTA ELECTRIC WIRE & CABLE Co., Ltd Conductive Materials Division 5-1,6chome,Kunimidai,Kizugawa city Kyoto, Japan, TEL FAX
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Competing with international EMI shielding film giants Tatsuta and Toyo Ink Group on the same stage, China EMI shielding film manufacturer has achieved China’s first place and has a global market shar
Competing with international EMI shielding film giants Tatsuta and Toyo Ink Group on the same stage, China EMI shielding film manufacturer has achieved China’s first place and has a global market share of 25% Hay:F05GZFB
In this oligopolistic EMI shielding film market, in the world, only companies in two Asian countries have a full set of technology and intellectual property rights for the products.
EMI shielding film, a new type of electronic material film, effectively blocks electromagnetic interference by confining electromagnetic waves within a certain range, and is currently widely used in electronic products such as smart phones and tablet computers.
This field of functional materials is currently an oligopoly market. In the world, only companies in two Asian countries have mastered the full set of technology and intellectual property rights for shields made of special materials. One is Japan’s Tatsuta, Toyo Ink Group, etc., and the other is China’s GZFB Electronics. Material Technology Group.
The embryonic form of EMI shielding film was printing silver paste ink, which was used in early flip phones, but excessive bending could easily cause silver paste to break. In 2000, Tatsuta, a Japanese company established in 1945, took the lead in launching metal alloy electromagnetic shielding films, which met the need for multiple bending of flexible printed circuit boards (FPC). Metal alloy electromagnetic shielding films have also become the mainstream use in the market. For electromagnetic shielding film products, Tatsuta monopolized the market for a long time.
Until 2012, GZFB successfully developed an electromagnetic shielding film with independent intellectual property rights, breaking Tatsuta’s technology monopoly, filling the gap in the Chinese market, and catching up with international counterparts in terms of product technology.
From its establishment to the listing, GZFB has been relying on its technical strength to achieve its electromagnetic shielding film products’ market share first in China and second in the world in 9 years.
FPC upstream material domestic substitution pioneer
“EMI shielding film is a scarce high-end electronic material, which plays an important role in ensuring the normal operation of electronic products.” Industry professionals use the “four highs” to describe the characteristics of this sub-industry: high technical barriers, high market barriers , High funding barriers, high scale barriers.
In terms of technical barriers, electromagnetic shielding film products have more complex raw material formulations, production processes, and quality control, and require a comprehensive grasp of precision coating technology, roll vacuum sputtering technology, continuous roll electroplating/solution technology, material synthesis and formulation technology, etc. Core technologies. At the same time, downstream applications put forward higher requirements for products. In addition to meeting the shielding effectiveness, they must also meet the requirements of lightness, bending resistance, and high peel strength.
At present, GZFB has produced an EMI shielding film product with a thickness of only 8 microns, which is only one-tenth the diameter of a hair. He has witnessed the difficulty behind the breakthrough in core technology. He used to solve the black ink and carrier of electromagnetic shielding film. The peeling force between the films has achieved a uniform, stable and controllable effect, and more than 10,000 experiments have been done.
In addition to mastering the complete production technology of metal alloy electromagnetic shielding film and independent intellectual property rights, and maturely promoted and applied in the market, in 2014 GZFB innovated and developed micro-needle electromagnetic shielding film according to market demand.
“This product has higher shielding effectiveness and lower insertion loss, and is more suitable for 5G high-frequency and high-speed environments. The technical level of the product has gradually caught up and surpassed the international advanced level.
The competitive landscape of the electromagnetic shielding film market presents an “oligopoly market” situation. Topaz has a market share of about 50%, and its products are mainly used in Apple mobile phones; Fangbang shares have a market share of about 25%, and its products are widely used in well-known terminal brand products such as Huawei, Xiaomi, OPPO, VIVO, and Samsung.
Consumer electronics is currently the main downstream application field of electromagnetic shielding films, and as 5G continues to be commercialized and improved, new 5G applications will bring new growth in the market. In the 5G high-frequency and high-speed environment, the demand for electromagnetic shielding films for single machines will increase, the penetration rate of electromagnetic shielding films in electronic products will also be higher, and the performance requirements for electromagnetic shielding films will be further improved.
At the same time, as electronic products further develop towards high-frequency, high-speed, and “light, thin, and small” trends, it is expected that electromagnetic shielding films will have more application areas, such as automotive electronics (new energy vehicles), high-definition displays, Wearable devices, etc.
Be the first in the world in the next three years
The main products of GZFB include electromagnetic shielding film, conductive adhesive film, ultra-thin flexible copper clad laminate and ultra-thin copper foil, etc. However, electronic shielding film, as its main product, is the company’s main source of revenue, and its revenue share has remained constant in recent years. More than 90%, from 2016 to 2019 were 99.41%, 99.23%, 98.78%, 95.99%.
The customer base of ultra-thin flexible copper clad laminate and ultra-thin copper foil has a high degree of overlap with the customer base of electromagnetic shielding film, which is beneficial to our market development. We must keep abreast of the progress of the project and strive for mass production as soon as possible. At the same time, we will continue to improve the product yield and strive to introduce these two new products to customers as soon as possible.
At present, GZFB has a total of 8 research projects. The company’s product line expansion and R&D investment are mainly focused on the continuous upgrade of electromagnetic shielding films and flexible copper clad laminates, liquid crystal polymer films, flexible connectors for microelectronic packaging, and shielding and wave absorption Materials, high-performance lithium battery copper foil and other fields.
“In the next three years, the company will increase the market share of electromagnetic shielding film products to the first place in the world.” The company will take the ultra-thin flexible copper clad laminate and ultra-thin peelable copper foil projects as a breakthrough to become a world-class high-end electronic material manufacturing Business and solution provider.
GZFB’s ultra-thin flexible copper clad laminate, ultra-thin copper foil and other products have been mass-produced, but due to production capacity constraints, they cannot be promoted on a large scale. Last year, the company invested more than 1 billion yuan in three projects: flexible copper clad laminate production base, shielding film production base, and R&D center.
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