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h20e silver epoxy 주제에 대한 동영상 보기
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d여기에서 BÁN KEO EPOXY TRONG SUỐT GIÁ 200K, 220K, 250K SIÊU CỨNG, SIÊU TRONG – h20e silver epoxy 주제에 대한 세부정보를 참조하세요
Keo hai thành phần AB được sử dụng khá phổ biến hiện nay, được sử dụng trong nhiều lĩnh vực: để đổ mặt bàn, làm đồ thủ công mỹ nghệ. 3D, quảng cáo. Công ty chúng tôi chuyên phân phối sỉ lẻ 1 ký, 5 ký, 10 ký, 20 ký và số lượng lớn, nếu quý khách đang muốn mua sản phẩm thì có thể liên hệ qua SĐT: 0376 451 485 để tư vấn, giao hàng nhanh khu vực TP.HCM, nhận giao chành ship COD.
Keo epoxy hai thành phần AB.
Keo epoxy được hình thành từ phản ứng polyme hóa giữa hai thành phần chính của nó là nhựa resin và chất làm cứng hardener. Khi nhựa resin được pha trộn với một chất xúc tác phù hợp, quá trình khô được bắt đầu.
Khô keo là quá trình các dải phân tử phản ứng hóa học một cách chủ động từ đó tạo ra phản ứng tỏa nhiệt. Cũng chính mối liên kết cộng hóa trị giữa nhựa resin với chất xúc tác hay hardener sẽ quyết định độ bền chắc, khả năng kết dính của keo Epoxy.
Hướng dẫn sử dụng:
+ Tỷ lệ phối trộn : 3 thành phần A keo Resin và 1 thành phần đóng rắn B Hardener
+ Độ nhớt hỗn hợp sau khi trộn : 400 đến 700 cPs.
+ Tỷ trọng sản phẩm : 1,05 (ở nhiệt độ 20 độ C )
+ Màu sắc : Trong suốt.
h20e silver epoxy 주제에 대한 자세한 내용은 여기를 참조하세요.
EPO-TEK – Technical Data Sheet
H20E. Technical Data Sheet. For Reference Only. Electrically Conductive, Silver … EPO-TEK® H20E is a two component, 100% sols silver-filled epoxy system …
Source: www.pg.infn.it
Date Published: 6/3/2022
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Epoxy Technology Inc EPO-TEK H20E Silver filled Epoxy 1oz kit
Two component, 100% sols silver-filled epoxy paste designed specifically for chip bonding in microelectronic and optoelectronic applications. H20E is used …
Source: www.fishersci.com
Date Published: 2/12/2022
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H20E EPO-TEK Epoxy -In Stock – Bonding Source
EPO-TEK® H20E is a two component, 100% sols silver-filled epoxy paste designed specifically for chip bonding in microelectronic and …
Source: bondingsource.com
Date Published: 6/29/2022
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EPO-TEK H20E epoxy, 28g – Agar Scientific
EPO-TEK® H20E is a two component, silver filled, epoxy system consisting of a silver resin paste and a silver resin hardener. The pure silver powder is …
Source: www.agarscientific.com
Date Published: 7/5/2022
View: 1031
EPO-TEK® H20E – QP Technologies
H20E. Technical Data Sheet. For Reference Only. Electrically Conductive, Silver Epoxy. Number of Components: Two. Frozen Syringe.
Source: www.qptechnologies.com
Date Published: 8/16/2022
View: 2988
Epo-Tek® H20E Adhesive – Electron Microscopy Sciences
EPO-TEK® H20E is a two-component, 100% sols silver-filled epoxy system designed for chip bonding in microelectronic and optoelectronic applications.
Source: www.emsdiasum.com
Date Published: 2/19/2022
View: 2134
EPO-TEK- H20E Electrical Epoxy – Paisley Products of Canada
EPO-TEK®H20E is a two component, 100% sols silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic …
Source: www.paisleyproducts.com
Date Published: 8/19/2022
View: 1973
주제와 관련된 이미지 h20e silver epoxy
주제와 관련된 더 많은 사진을 참조하십시오 BÁN KEO EPOXY TRONG SUỐT GIÁ 200K, 220K, 250K SIÊU CỨNG, SIÊU TRONG. 댓글에서 더 많은 관련 이미지를 보거나 필요한 경우 더 많은 관련 기사를 볼 수 있습니다.
주제에 대한 기사 평가 h20e silver epoxy
- Author: Cung Cấp Sỉ Lẻ Keo Epoxy Trong Suốt AB
- Views: 조회수 6,687회
- Likes: 좋아요 47개
- Date Published: 2021. 10. 4.
- Video Url link: https://www.youtube.com/watch?v=AcOiI76hFDY
Epoxy Technology Inc EPO-TEK® H20E Silver filled Epoxy 1oz kit
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H20E EPO-TEK Epoxy -In Stock
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EPO-TEK H20E epoxy, 28g
The chemicals and mixtures offered by Agar Scientific are labelled with the appropriate hazard symbols and risk and safety phrases in accordance with current UK regulations and EC directives. The absence of symbols or risk and safety phrases should not be taken to indicate that the product is non-hazardous, particularly since new data and legislation requirements are always under review. Material Safety Data Sheets (MSDS/SDS) are available to download to assist in the safe handling and storage of products and the completion of any requirements under COSHH. Our web entries indicate the main hazards, providing guidance towards safe handling, storage and shipping.
Our products are intended for use only by qualified personnel in laboratory or industrial conditions. They are not intended for use by private individuals or in domestic environments.
Epo-Tek H20S Adhesive
Epo-Tek® H20E Adhesive
EMS #12671-20E
EPO-TEK® H20E is a two-component, 100% solids silver-filled epoxy system designed for chip bonding in microelectronic and optoelectronic applications. It is also used for thermal management applications due to its high thermal conductivity. It is a reliable system, making it the conductive adhesive of choice for new applications. In addition, it is also available in single component frozen syringe.
Technical Information
Composition Properties
Number of Components Two Mix Ratio by Weight 1:1 Specific Gravity Part A: 2.03
Part B: 3.07
(Frozen Syringe: 2.67) Pot Life 2.5 Days Shelf Life One year at 23°C
(Frozen Syringe: One year at -40°C)
Minimum Bond Line Cure Schedule
175°C 45 seconds 150°C 5 minutes 120°C 15 minutes 100°C 2 hours 80°C 3 hours
Note: Container should be kept closed when not in use. For filled systems, mix contents of each container (A&B) thoroughly before mixing the two together.
Epo-Tek® H20E Advantages and Application Notes
Processing Information: It can be applied to many dispensing, stamping, and screen printing techniques
Dispensing: Compatible with pressure/time delivery, auger screws, fluid jetting and G27 needles, in a single-component fashion
Screen Printing: Best using >200 metal mesh, with polymer squeegee blade with 80D hardness
Stamping: Small dots 6 mil in diameter can be realized
Miscellaneous/Other Notes
Many technical papers written over 30-40 year lifetime
Over 1 trillion chips attached at a single company
Versatility in curing techniques including box oven, SMT style tunnel oven, heater gun, hit plate, IR, convection, br inductor coil
Many custom modified products available for the following improvements: viscosity and appearance, flexibility, and thermal conductivity
Typical Properties
To be used as a guide only, not as a specification. Data below is not guaranteed. Different batches, conditions and applications yield different results; Cure condition: 150°C/1 hour; * Denotes test on lot acceptance basis.
Physical Properties
*Color Part A: Silver
Part B: Silver *Consistancy Smooth, thixotropic paste *Viscosity (@ 100 RPM/23°C) 2,200-3,200 cPs Thixotropic Index 4.63 *Glass Transition Temp. (Tg) ≥80°C (Dynamic cure 20-200°C/ISO 25 min; Ramp -10 to 200°C @ 20°C/min) Coefficient of Thermal Expansion (CTE): Below Tg: 31 x 10-6 in/in/°C
Above Tg: 158 x n10-6 in/in/°C Shore D Hardness 75 Lap Shear Strength @ 23°C 1,475 psi Die Shear Strength @ 23°C >10 Kg/3,400 psi Degradation Temp. (TGA) 425°C Weight Loss @ 200°C: 0.59%
@ 250°C: 1.09%
@ 300°C: 1.67% Operating Temp. Continuous: -55°C to 200°C
Intermittent: -55°C to 300°C Storage Modulus @ 23°C 808,700 psi Ions C1-: 73 ppm
Na+: 2 ppm
NH 4 +: 98 ppm
K+: 3 ppm *Particle Size ≤45 microns
Electrical Properties
*Viscosity Resistivity @ 23°C ≤0.0004 Ohm-cm
Thermal Properties
Thermal Conductivity 2.5 W/mK
Based on standard method: Laser flash Thermal Conductivity 25 W/mK
Based on thermal resistance data: R = L x K-1 x A-1 Thermal Resistance (Junction to Case) TO-18 package with nickel-gold metallized 20 x 20 mil chips and bonded with EPO-TEK® H20E (2 mils thick)
Epo-Tek® H20E: 6.7 to 7.0°C/W
Solder: 4.0 to 5.0°C/W
Epo-Tek®H20E Suggested Applications
Semiconductor IC Packaging
Die-attaching chips to leadframes; compatible with Si and MEM’s chips, 260°C lead-free reflow and JEDEC Level 1 packaging requirements
Capable of being snap cured in-line, as well as traditional box oven techniques
Adhesive for solderless flip chip packaging and ultra-fine pitch SMD printing
Hybrid Micro-Electronics
A comparable alternative to solder and eutectic die attach, in terms of thermal performance; very commonly no more than 1-2°C/watt difference in thermal resistance
Die-attaching of quartz crystal oscillators (QCO) to the Au posts of TO-can style lead frame
Used with GaAs chips for microwave/radar application up to 77GHz Compatible with Au, Ag, Ag-Pd terminations of capacitors and resistor SMDs
NASA approved low outgassing adhesive
Adhesive for EMI and Rf shielding of Rf, microwave and IR devices
Electronic & PCB Circuit Assembly
Used to make electrical contacts in acoustical applications of speakers/microphones
Electrical connection of piezo’s to PCB. Oads of PZT are connected to many kinds of circuits using H20E, including ink jet heads, MEMs and ultrasound devices
Automotive applications include pressure sensing and accelerometer circuits
Electrically conductive adhesive (ECA) for connections of circuits to Cu coils in Rf antenna applications such as smart cards and RFID tags
ECA for attaching SMDs to membrane switch flex circuits. Compatible with Ag-PTF and carbon graphite PCB pads. A low temperature “solder-free” solution
Solar-Photovoltaic industry ECA for the electrical connection of transparent conductive oxide (TCO) to PCB pads Replacement of solder joints of Cu/Sn ribbon wire, from cell-to-cell; a common “solar cell stringing” adhesive Die-attach of III-V semiconductor chips to substrates using Cu, BeO, aluminum nitride, etc.
Ability to be dispensed in high volumes via dots, arrays, and writing methods
Medical Applications
USP Class VI adhesive for circuits requiring implantation/biocompatibility
Die-attaching photo diode arrays in X-ray circuits
Vibration resistant adhesive for ultrasound applications <20 MHz frequency; making the electrical connection of PZT to Au/PCB substrate Electrical connections of die, SMFs and QCO for pacemaker hybrid circuits A common ECA for hearing aid applications using hybrid, ECM or MEMs technology Opto-Electronic Packaging Applications Adhesive for fiber optic components using DIP, Butterfly or custom hybrid IC packages. As an ECA it attaches waveguides, die bonds laser diodes and hear sinks the high power laser circuits Die-attaching IR-detector chips onto PCBs or TO-can style headers Die-attaching LED chips to substrates using single chip packages, or arrays Adhesion to Ag, Au, and Cu plated leadframes and PCBs Electrical connection of ITO to PCBs found in LCD industry A low temp ECA for OLED displays and organically printable electronics Product Information Epo-Tek® H20E Adhesive
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